TSMC Reportedly Developing Advanced Chip Packaging Tech to Challenge Intel

3-line summary

• TSMC is reportedly developing an advanced chip packaging technology, internally called "EMIB Like" and similar to Intel's Embedded Multi-die Interconnect Bridge, in partnership with Taiwan's Kinsus Interconnect Technology, according to a report by The Information.
• Nvidia is separately evaluating Intel's own EMIB packaging technology for a future processor, per the same report.

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